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*総電子グレードのシリコンスライス - 磨かれていないウェーハと再生ウェーハを除外します。
出荷は半導体アプリケーションのみであり、ソーラーアプリケーションは含まれていません
硅晶圆是大多数半导体的基本材料、是所有电子产品的重要部件。高度工程化的晶圆片直径可达12英寸、可用作制造大多数半导体器件的衬底材料。
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.